Mounting Configurations
Flexible System Integration
GPD is proud to offer multiple packaging solutions to best fit your application. Our Standard configurations are mentioned below, and custom packaging is also available.
- TO Packages: A broad selection of Transistor Outline (TO) packages is available, with choices determined by photodiode size and the pinout requirements of your application.
- Chip on Ceramic Submount: GPD provides a variety of standard ceramic submounts and can also develop custom ceramic designs tailored to your application. Chips may be bonded using either epoxy or eutectic solder, depending on performance and reliability needs.
- Leadless Chip Carrier (LCC) Packaging: GPD offers LCC packaging solutions for applications requiring compact size, robust performance, and reliable surface-mount integration. These packages eliminate traditional leads, reducing parasitics and improving high-frequency performance. LCC designs are well-suited for space-constrained environments, are available in tape-and-reel, and can be customized to meet specific electrical, thermal, and optical requirements.
- Custom Packaging Solutions: GPD Optoelectronics also specializes in advanced and application-specific packaging solutions that support unique form factors, environmental conditions, and integration requirements. From hermetic sealing to specialized optical interfaces, GPD works closely with customers to design and manufacture packaging that optimizes device performance, reliability, and ease of integration into complex systems.
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Custom Packaging
Don’t see what you need? We offer custom packaging for your application, including plastic packaging, SMT, LCC, and more. Click here to contact us!