Available Features

Mounting Configurations

Mounting Configurations

GPD is proud to offer multiple packaging solutions to best fit the needs of your application. Our Standard configurations are mentioned below, and custom packaging is also available.

To Packages:

A wide variety of TO packages are available. Selection is based on the size of the photodiode and the pinout requirements of your application.

Chip on Ceramic Submount:

GPD offers a variety of standard ceramics, and can also design a ceramic unique to your application. Chips can be bonded with epoxy or eutectic solder.

Custom Packaging

Don't see what you need? We offer custom packaging for your application, including plastic packages, SMT, LCC, etc.

GPD qualifications

Our compliance, certificates, and capabilities.