GPD is proud to offer multiple packaging solutions to best fit the needs of your application. Our Standard configurations are mentioned below, and custom packaging is also available.
A wide variety of TO packages are available. Selection is based on the size of the photodiode and the pinout requirements of your application.
GPD offers a variety of standard ceramics, and can also design a ceramic unique to your application. Chips can be bonded with epoxy or eutectic solder.